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Kontak: Ms. Elysia

Telp: +86 18926538696

Faks: 86-0755-2733-6216

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4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 977083CM Specification for Automatic BGA Repair

Rincian produk

Tempat asal: Tiongkok

Nama merek: Wisdomshow BGA

Dokumen: Brosur Produk PDF

Syarat Pembayaran & Pengiriman

Kuantitas min Order: 1

Harga: 18800

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Rincian produk

Deskripsi Produk

Menyoroti: 
                                                                                                                                                                                                                                                                                                                                                                                                            4200W Rated Capacity BGA Rework Station, 100% Duty Cycle BGA Reballing Machine, 97*70*83CM Specification BGA Repair Machine
                      

Nomor Model.:	WDS-850	Kapasitas Dinilai:	4200W
Siklus Tugas Terukur:	100%	Tipe Mesin:	Mesin Perbaikan BGA
Berat:	210 kg	Ukuran:	977083CM
Kapasitas Produksi:	5000	Daya Pemanas Atas:	1200W
Daya Pemanas Bawah:	1200W	daya IR:	5000W
Ukuran Pelat Maks:	650*610mm	Area Pemanasan Awal:	500*420mm
Tahan Panas:	1800 C	Kontrol tekanan:	10 Gram
Kontrol suhu:	8 segmen

Nomor Model.:	WDS-850
Kapasitas Dinilai:	4200W
Siklus Tugas Terukur:	100%
Tipe Mesin:	Mesin Perbaikan BGA
Berat:	210 kg
Ukuran:	977083CM
Kapasitas Produksi:	5000
Daya Pemanas Atas:	1200W
Daya Pemanas Bawah:	1200W
daya IR:	5000W
Ukuran Pelat Maks:	650*610mm
Area Pemanasan Awal:	500*420mm
Tahan Panas:	1800 C
Kontrol tekanan:	10 Gram
Kontrol suhu:	8 segmen

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

BGA Rework Station - Automatic Chip Removal and Mounting Machine

Product Overview

Our BGA Rework Station is designed for professional chip replacement and repair in laptops, mobile phones, gaming consoles (Xbox 360, PS3/PS4), and other electronic devices. Ideal for repair shops and factories providing after-sales service and component rework.

Repair Process

Desoldering: Separate BGA chip from motherboard
Pad cleaning
Reballing or direct BGA chip replacement
Precision alignment (using silk frame or optical camera)
Soldering: Install new BGA chip

Applications

Watch/Mobile/Cell phone repair
Notebook/Laptop/Computer repair
XBOX 360/PS2/PS3/PS4/Wii game console repair
SMD/SMT/IC BGA rework including iCloud removal
BGA VGA, CPU, GPU, ECU and car motherboard soldering/desoldering
BGA chips, QFP QFN chip, PC, PLCC PSP PSY rework

Key Features

Integrated hot air head and mounting head with automatic soldering/desoldering
Independent 3-zone heating system with synchronized upper/lower heater movement
High-precision PCB slider for accurate BGA mounting
German-imported preheating table (500×420mm) with heat-resistant glass (up to 1800°C)
Motor-controlled X/Y axis movement for precise alignment
Maximum PCB size capacity: 650×610mm with no repair dead corners
Built-in vacuum pump with 360° rotation and fine-adjustable suction nozzle
Automatic BGA height detection with pressure control (down to 10g)