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Stasiun Pengolahan Ulang BGA Semi Otomatis
Manual BGA Rework Station
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Rumah > Produk > Stasiun Pengolahan Ulang BGA Semi Otomatis > High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
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Kontak: Ms. Elysia
Telp: +86 18926538696
Faks: 86-0755-2733-6216
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High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing

High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing

Rincian produk

Tempat asal: Cina

Nama merek: WISDOMSHOW

Sertifikasi: CE, ISO, FDA

Nomor model: WDS620

Dokumen: Brosur Produk PDF

Syarat Pembayaran & Pengiriman

Kuantitas min Order: 1

Dapatkan Harga Terbaik

Rincian produk

Deskripsi Produk
Menyoroti:

High Precision BGA Rework Station

,

Semi Automatic BGA Reballing Machine

,

5200W Power Motherboard Repair Machine

Beban pemasangan maksimum:
150g
Jenis:
Semi otomatis
Akurasi pemasangan:
±0,01 mm
Berat:
12kg
Berat mesin:
60kg
Ukuran chip:
Minimal 1*1mm
Terapkan ukuran chip:
Ukuran 0,8*0,8~120*120mm
Beban pemasangan maksimum:
150g
ketebalan PCB yang berlaku:
0,5-5mm
Catu daya:
5300W
Ukuran chip BGA:
Maksimal 120*120mm Minimal 0,8*0,8mm
Aplikasi:
Pengerjaan Ulang BGA (Ball Grid Array).
Ukuran PCB:
Max. 470x380mm
Komponen Inti:
PLC
Voltase:
220V
Beban pemasangan maksimum:
150g
Jenis:
Semi otomatis
Akurasi pemasangan:
±0,01 mm
Berat:
12kg
Berat mesin:
60kg
Ukuran chip:
Minimal 1*1mm
Terapkan ukuran chip:
Ukuran 0,8*0,8~120*120mm
Beban pemasangan maksimum:
150g
ketebalan PCB yang berlaku:
0,5-5mm
Catu daya:
5300W
Ukuran chip BGA:
Maksimal 120*120mm Minimal 0,8*0,8mm
Aplikasi:
Pengerjaan Ulang BGA (Ball Grid Array).
Ukuran PCB:
Max. 470x380mm
Komponen Inti:
PLC
Voltase:
220V
High Precision Semi Automatic BGA Rework Station with 5200W Power for Motherboard Repair and Reballing
Hot Air Infrared Combo BGA Rework Station WDS620
High Precision BGA Reballing Machine - WDS 620 BGA Reballing Machine, AC 220V BGA Soldering Machine
Technical Specifications
Power Supply AC 220V±10% 50/60Hz
Total Power 5200W
Upper Heater Power Max 1200W
Lower Heater Power Max 1200W
IR Heater Power Max 2700W
Detailed Parameter Specification
Power Supply AC 110V/220V±10% 50/60Hz
Total Power Max 5300W
Heater Power Distribution Upper zone: 1200W, Second zone: 1200W, IR zone: 2700W
Electrical Components Driving motor + PLC smart temperature controller + color touch screen
Temperature Control High precision K-sensor (Closed Loop), independent temperature controller, precision ±1℃
Positioning System V-shape slot, adjustable PCB support jigs, laser light for fast centering and positioning
PCB Size Range Max 500*380mm, Min 10*10mm
Applicable Chip Sizes Max 80*80mm, Min 1*1mm
Overall Dimensions 650*630*850mm (L*W*H)
Temperature Interface 1 unit
Machine Weight 60KG
Color White & Blue
Advanced Operating Modes
The WDS-620 features 5 operational modes: Remove, Mount, Weld, Manual, and Semi-auto. Operators can freely switch between automatic, semi-automatic, and manual operation modes.
Independent 3-Zone Temperature Control System
  • Upper and lower hot air heating simultaneously targets components and PCB
  • Bottom IR heating with temperature precision control within ±1℃
  • 8-segment independent temperature control system
  • Hot air district heating for BGA and PCB simultaneously
  • Large area IR heater preheating prevents PCB deformation during rework
  • Upper and lower temperature zones can operate independently or combined
  • High precision K-type thermocouple closed-loop control with PID parameter self-setting
  • 4 temperature curves display with instant analysis function
  • Multiple user data profiles can be saved
  • External measurement interface for precise temperature testing
Precision Optical Alignment System
High-definition adjustable CCD color optical alignment system with beam split, amplification, reduction, and auto-focus capabilities. Features automatic color aberration resolution, brightness adjustment, and adjustable image contrast. Equipped with 15" high-definition LCD monitor.
Multi-Functional Operation System
  • High-definition touch human-machine interface
  • Upper heating head and mounting head designed as 2-in-1 unit
  • Multiple titanium alloy BGA nozzles with 360-degree rotation
  • X, Y, and R angle micrometer fine-tuning with ±0.01mm precision
Safety Protection Features
  • Automatic alarm function after BGA welding completion
  • Automatic circuit power-off during temperature abuse conditions
  • Dual over-temperature protection system
  • Temperature parameter password protection to prevent unauthorized modifications

Tags:

Mesin Reballing BGA,

Mesin pemotong BGA,

Stasiun reflow BGA

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Shenzhen Wisdomshow Technology Co.,ltd
Produk

Stasiun Pengolahan Ulang BGA Semi Otomatis

Manual BGA Rework Station

Stasiun Pengolahan Ulang BGA yang sepenuhnya otomatis

Mesin Reballing BGA

Telepon Seluler BGA Rework Station

Infrared BGA Rework Station

Mesin pemeriksaan sinar-X offline

elysia.li@wdsbga.cn 86-189-2653-8696
Tidak, tidak.6Industri Barat Haosi, Kota Shangjing, Distrik Bao'an, Shenzhen, Cina
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